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5.0 mm
PACKAGE DIMENSIONS
DIA LED
LAMP
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ITEM RESIN MATERIALS Epoxy Resin Sn Plating iron Alloy
520PG2C-F2
LEAD FRAME
Note: 1.All Dimensions are in millimeters. 2.Tolerance is 0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice 6.highlight <-400V the led can withstand the max static level when assembling or operation(HBM). 7. The lamps have sharp and hard points that may injure human eyes or fingers etc., so please pay enough care in the handling.
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FEATURES * SUITABLE HIGH PULSE CURRENT OPERATION * EXTRA HIGH RADIANT INTENSITY * HIGH RELIABILITY * LOW FORWARD VOLTAGE * Pb FREE PRODUCTS CHIP MATERIALS * Dice Material : GaInN/GaN * Light Color : ULTRA PURE GREEN * Lens Color : WATER CLEAR ABSOLUTE MAXIMUM RATING : ( Ta = 25C )
SYMBOL PD VR IF IFP Topr Tstg DESCRIPTION Power Dissipation Per Chip Reverse Voltage Per Chip Average Forward Current Per Chip Pulse Forward Current Derating Linear From 25C Per Chip Operating Temperature Range Storage Temperature Range ULTRA PURE GREEN 120 5 30 100 0.4
UNIT mW V mA mA mA/C
-25C to 85C -25C to 85C
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25C )
SYMBOL VF IR D 21/2 IV DESCRIPTION Forward Voltage Reverse Current Dominant Wavelength Spectral Line Half-Width Half Intensity Angle Luminous Intensity TEST CONDITION IF = 20mA VR = 5V IF = 20mA IF = 20mA IF = 20mA IF = 20mA 525 25 15 7200 MIN. TYP. 3.7 MAX. 4.0 100 UNIT V A nm nm deg mcd
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SOLDERING
METHOD
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SOLDERING CONDITIONS REMARK
Solder no closer than 3mm from the DIP SOLDERING Bath temperature: 260 Immersion time: with 5 sec ,1time base of the package Using soldering flux," RESIN FLUX" is recommended. Attached data of temperatuare cure for your reference
During soldering, take care not to press the tip of iron against the lead. Soldering iron: 30W or smaller SOLDERING Temperature at tip of iron: 360 or lower (To prevent heat from being IRON transferred directly to the lead, hold Soldering time: within 3 sec. the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip.
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
Lead wries
Leave
a slight clearance
(Fig.2)
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin & copper and sliver is proposed with the temperature of Celsius 260. The proportion of the alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly 3 seconds.
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avoid steering the leads (See Fig.3).
PC board
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
F ig.3 jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature.
STORAGE
1) The LEDs should be stored at 30 or less and 70% RH or less after being shipped from PARA and the storage life limits are 3 months . 2) PARA LED lead frames are comprised of a stannum plated iron alloy. The silver surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LEDs to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur.
STATIC ELECTRICITY
1) Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. 2) All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. 3) When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). 4) Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current . Criteria : ( VF>2.0V at IF=0.5mA )
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LED MOUNTING METHOD
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4) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4)
case
pc board
Fig.4
5) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
Tube
Stand-off
Fig.5
Fig.6
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FORMED LEAD
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should be performed with base fixed means of a jig or pliers (Fig.7)
1) The lead should be bent at a point located at least 2mm away from the package. Bending
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8)
LEAD STRENGTH
1) Bend strength Do not bend the lead more than twice. (Fig.9)
Fig.9
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2mm
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2) Tensile strength (@Room Temperature)
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If the force is 1kg or less, there will be no problem. (Fig.10)
OK
1Kg
Fig.10
HEAT GENERATION
1) Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. The operating current should be decided after considering the ambient maximum temperature of LEDs.
CHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT Freon TE Chlorothene Isopropyl Alcohol Thinner Acetone Trichloroethylene --Usable ADAPTABILITY NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical.
--Do not use.
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OTHERS
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1) Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum 2) rating when using the LEDs with matrix drive. Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult PARA's sales staff in advance for information on the applications in which exceptional quality and reliability are required , particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from PARA. When defective LEDs are found, the User shall inform PARA directly before disassembling or analysis. The formal specifications must be exchanged and signed by both parties before large volume purchase begins. The appearance and specifications of the product may be modified for improvement without notice.
3)
4)
5) 6)
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Bin Code List
Forward Voltage (VF), Unit:v@20mA Bin Code V0 V1 V2 V3 V4 V5 Min 2.8 3.0 3.2 3.4 3.6 3.8 Max 3.0 3.2 3.4 3.6 3.8 4.0
Tolerance of each bin are0.1Volt
Dominant Wavelength(D), Unit:nm@20mA Bin Code D3 D4 D5 D6 D7 Min 510 515 520 525 530 Max 515 520 525 530 535
Luminous Intensity(IV), Unit:mcd@20mA Bin Code K L M N O Min 2950 4130 5780 8090 11330 Max 4130 5780 8090 11330 15860
Tolerance of each bin are15%
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